2024/02/21 AI New Prosperity》CoWoS production capacity is insufficient to meet the demand for AI chips, Taiwanese manufacturers are actively expanding production With the booming development of technologies such as AI, cloud, big data analysis, and mobile computing, modern society has increasingly higher demands for computing power. After 3 nanometers, wafer size has reached physical limits and manufacturing costs have increased. For reasons such as this, in addition to continuing to develop advanced manufacturing processes, the semiconductor industry is also looking for other ways to maintain a small size of chips while maintaining high performance. The concept of "heterogeneous integration" has thus emerged in contemporary science, and chips have also evolved from The original single layer turned to multi-layer stacked advanced packaging.
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