China launches 18 new wafer fabs this year! SEMI: Global monthly semiconductor production capacity reaches 30 million pieces

2024/01/10

SEMI International Semiconductor Industry Association released the latest quarterly World Fab Forecast (WFF). After global semiconductor production capacity grew by 5.5% in 2023 to 29.6 million wafers per month (wpm), it is expected that In 2024, the growth rate will increase by 6.4%, exceeding the 30 million tablet mark.

The latest quarterly global fab forecast report shows that during the forecast period from 2022 to 2024, the global semiconductor industry plans to have 82 new facilities put into production, of which 11 will be put into production in 2023 and 42 in 2024, covering 4-inch (100mm) ) to 12-inch (300mm) wafer production lines.

Different from the moderate capacity expansion in 2023, which is mainly due to slowing market demand and semiconductor inventories entering a period of adjustment, 2024 will include the promotion of applications such as generative AI and high-performance computing (HPC), as well as the recovery of terminal demand for chips. Accelerate the expansion of advanced manufacturing processes and wafer foundry capacity.

SEMI Global Marketing Chief and Taiwan President Cao Shilun said that global market demand is recovering, government incentives of various countries have driven significant growth in fab construction and equipment investment in major chip manufacturing regions, and semiconductor strategies are increasingly influencing the global political and economic situation. It has become a key catalyst for the growth of semiconductor production capacity, and global production capacity is expected to grow by 6.4% in 2024.

China boosts semiconductor industry expansion

Benefiting from government funding and other incentives, China is expected to expand its share of global semiconductor production capacity. Chinese chip manufacturers are expected to launch 18 new wafer fabs in 2024, with the annual growth rate of production capacity rising from 12% in 2023. Increase to 13% in 2024, and production capacity will increase from 7.6 million pieces to 8.6 million pieces.

Taiwan will still maintain its ranking as the second largest semiconductor production capacity in the world. The annual growth rates of production capacity will be 5.6% in 2023 and 4.2% in 2024. The monthly production capacity will grow from 5.4 million pieces to 5.7 million pieces. It is expected that starting from 2024 Five new wafer fabs have been put into operation, and South Korea, which ranks third in global semiconductor production capacity, is expected to have one new wafer fab put into operation in 2024, with production capacity increasing by 5.4% from 4.9 million wafers in 2023 to 5.1 million wafers in 2024. As for Japan, which ranks fourth in the world in production capacity, is expected to have four new wafer fabs put into operation in 2024, with production capacity growing from 4.6 million wafers in 2023 to 4.7 million wafers in 2024, with an annual growth rate of approximately 2%.

The global fab forecast report shows that six new fabs will be put into operation in the Americas by 2024, and the annual growth rate of wafer production capacity will reach 6% to 3.1 million pieces. As for Europe and the Middle East, there will be four new fabs in Europe and the Middle East in 2024. A new wafer fab will be put into operation, and the production capacity is expected to increase by 3.6%, reaching 2.7 million pieces. Finally, four new wafer fabs will be put into operation in Southeast Asia in 2024, and the production capacity is expected to increase by 4%, to 1.7 million pieces.

Capacity in the foundry field continues to grow strongly

Wafer foundries combined will continue to purchase the largest amount of semiconductor equipment, leading the expansion of the semiconductor industry. Their production capacity will increase from 9.3 million pieces in 2023 to a new record of 10.2 million pieces in 2024. It will be affected by personal computers and smartphones, etc. Affected by the weak demand for consumer electronics products, the expansion of production capacity in the memory field will slow down in 2023. The production capacity in the DRAM field is expected to increase slightly by 2% to 3.8 million pieces in 2023 and by 5% to 4 million pieces in 2024; 3D NAND monthly Production capacity is expected to remain flat at 3.6 million pieces in 2023, and will grow 2% to 3.7 million pieces the following year.

In the field of discrete components and analogs, the progress of electric vehicles is still a key driver of capacity expansion. The production capacity of discrete components is expected to grow by 10% in 2023, reaching 4.1 million pieces, and by 2024, it will grow by 7%, reaching 4.4 million pieces, while analog The industry's production capacity is expected to grow by 11% to 2.1 million pieces in 2023, and by 10% to 2.4 million pieces in 2024.

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