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[NOWnews Today's News] The Taiwan Circuit Board Association (TPCA) announced today (18th) that it has recently released the "2024 Mainland China PCB Industry Dynamics Observation" with the Institute of Obstetrics and Technology of the Industrial Research Institute. The report pointed out that the global market share of the Chinese-funded PCB industry in 2023 will be approximately It is 30%, with an output value of US$22.98 billion, ranking second in the world. Its main applications focus on communications, automobiles, computers and consumer electronics.

Governments around the world are actively promoting the semiconductor manufacturing industry. Malaysia has been developing in this market for 50 years and has a sound infrastructure and supply chain. It is now a semiconductor center in Southeast Asia. In recent years, under the leadership of the government, it has attracted major international manufacturers. One after another, they have invested. Due to Malaysia's various advantages, many Taiwanese packaging and testing and equipment companies are also actively rushing in and setting up strongholds, hoping to seize the opportunity to win overseas orders.

IT House reported that Canalys announced on the 14th that global AI PC shipments in the third quarter of 2024 reached 13.3 million units, a quarterly increase of 49%, accounting for 20% of total PC shipments in the quarter. The report mentioned that for the first time, Windows devices accounted for the majority of AI-enabled PC shipments, with a market share of 53%; although the Windows 11 update cycle and processor roadmap will continue to promote the popularity of AI PCs, the key challenge in the future will be How to convince customers to be proactively prepared for the upcoming explosion of end-side AI applications.

Electronic paper giant E Ink's revenue in October was impressive. It has signed contracts with financial institutions such as Mega Bank to complete a joint loan of NT$12 billion (the same below). It has two major industries: e-book readers and electronic shelf labels. The field continues to receive orders.

Even in the past two years after the epidemic, terminal products including electric vehicles and generative AI have continued to introduce new ones. However, due to the sluggish consumer electronics industry and rising raw material costs, for Taiwan’s PCB industry, energy conservation, carbon reduction and China+1 The sustainable strategic layout is a lingering challenge, and it is also the key to whether future output value can stabilize and grow!

Artificial intelligence AI chips drive CoWoS advanced packaging to be in short supply. TSMC is still the leader in CoWoS production capacity, and ASE Investment Controls is actively cooperating with the layout. Although TSMC cooperates with packaging and testing factory Amkor in Arizona, the CoWoS production capacity is still in Taiwan. , it is estimated that ASE Investment Holdings’ advanced packaging and testing performance will explode next year.