ESD-DLC Coating

As the chip size gets smaller , the components used in packaging and testing even wafer manufacturing, including fixtures (Hot Plate, Change kit, Contact chuck...), rails, carrier plates, vibration plates, Molds, etc., all need to have antistatic features to protect the product during the production process and avoid problems such as damage caused by static electricity.

Through research and industry measurements, Creatin NanoTechologies,INC. has successfully realized a thin film with anti-static dissipative ability on its surface through multiple composite technologies, combined with PVD/PECVD and other special multilayer stacking technologies. The technology of CNT has been in mass production for more than five years, and its stability and reliability have been certified by customers for many years.

Related solutions
◆ Material is conductive material:

1. Stainless steel
2. HSS (ASP23)
3. SKD11、61
4.FDAC (+plating Cr)
5. Tungsten steel
6. Blue steel (+plating Cr)
7. Aluminum alloy

◆ Material is non-conducting material:
1. Aluminum alloy (6 series) + hard anode
2. Ceramics (only plane)
3. Engineering plastics (PEEK, only plane)
4. Glass fiber (only plane)

• Feature of product Antistatic resistance value: 105~108Ω.
• High hardness: pencil hardness>9H (HV1800~2200).
• The friction coefficient is small, wear resistance, and the feedback life can reach more than 5 times the level (package test fixture).
• Good corrosion resistance.
• The coating will not peel off at low temperature (-50℃)/high temperature (200℃)/, and the resistance value remains stable.
• The coating is smooth and non-sticky.