SEMI: Global wafer fab production capacity continues to rise, with increases of 6% and 7% in 2024 and 2025
Technews Technology News
June 24, 2024
Author Atkinson
June 24, 2024
Author Atkinson
SEMI International Semiconductor Industry Association's latest Global Fab Forecast report (World Fab Forecast) points out that rising chip demand has driven global semiconductor wafer fab production capacity to continue to grow, with increases of 6% and 7% respectively in 2024 and 2025, with monthly production capacity reaching a record A new high of 33.7 million 8-inch wafers.
SEMI said that fueled by sub-5nm process data center training, inference and advanced process generation AI artificial intelligence technology, it is expected to grow by 13% in 2024. In order to improve chip energy efficiency, major chip manufacturers such as Intel, Samsung and TSMC are preparing to produce 2nm gate-all-around (GAA) chips in 2025, resulting in a 17% increase in total advanced process production capacity in 2025.
SEMI Global Marketing Chief and Taiwan President Shi-Lun Tsao analyzed that from cloud computing to various edge devices, AI is everywhere, making the competition for high-performance chip development more intense, driving the strong expansion of global semiconductor manufacturing capacity, and creating a positive cycle: AI accelerates the development of various industries. The growth of semi-conductor applications will encourage higher investment.
Chinese chip manufacturers are expected to maintain double-digit capacity growth, with a 15% increase this year to 8.85 million pieces per month and a further 14% growth to 10.1 million pieces in 2025, accounting for almost one-third of the industry's total. Despite the risk of over-expansion, China is still actively investing in expanding production in order to mitigate the impact of recent export controls and other reasons. Huahong, Nexchip, Sien Integrated and SMIC And DRAM manufacturer Changxin Memory has stepped up investment to increase China's semiconductor production capacity.
Capacity growth in other major chip manufacturing regions is expected to be no more than 5% by 2025. Taiwan ranked second with monthly production of 5.8 million units (up 4%). After exceeding 5 million pieces for the first time this year, South Korea is expected to rise another 7% in 2025 to rank third with 5.4 million pieces. The semiconductor production capacity of Japan, America, Europe, the Middle East and Southeast Asia is respectively 4.7 million pieces (annual increase of 3%), 3.2 million pieces (annual increase of 5%), 2.7 million pieces (annual increase of 4%) and 1.8 million pieces (annual increase). increased by 4%).
Benefiting from Intel's establishment of wafer foundry services and China's production capacity expansion, the wafer foundry sector's production capacity will grow by 11% in 2024 and 10% in 2025, with a monthly production of 12.7 million wafers by 2026.
The rapid growth in the computing power of artificial intelligence servers has also driven the demand for high-bandwidth memory (HBM), providing a growth momentum that has not been seen in the memory sector for a long time. The implementation of explosive AI requires HBM stack configuration (stack) to be tight, and each HBM can integrate 8~12 dies. This is why many DRAM market leaders have increased investment in HBM/DRAM. DRAM production capacity will grow by 9% this year and next, while the 3D NAND market is recovering slowly. Production capacity will not increase this year, but will increase by 5% in 2025.
With the rise of artificial intelligence applications in edge devices, the DRAM capacity of mainstream smartphones has also increased from 8GB to 12GB. Laptops equipped with artificial intelligence assistants have a demand for at least 16GB of DRAM. The expansion of artificial intelligence to edge devices is expected to drive up the demand for DRAM.
Related links: https://technews.tw/2024/06/24/global-wafer-fab-production-capacity-continues-to-rise/
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