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Creating Nano technology deploys advanced packaging and carrier technology to lead the development of hybrid bonding and plasma technology

Creating Nano technology deploys advanced packaging and carrier technology to lead the development of hybrid bonding and plasma technology
economic daily
October 23, 2024
Author Economic Daily Zhang Jie
 

Creating Nano technology, one of the leading manufacturers in the field of plasma equipment, is actively deploying advanced packaging and carrier board technology, and continues to promote innovation in chip connection technology. As packaging technology moves from 2.5D to 3D, chip stacking connection has become a global semiconductor The core technology of industrial competition, among which "Hybrid Bonding" is regarded as the key to future chip packaging. With its excellent plasma process and equipment development capabilities, Creating Nano technology has seized on this technology trend and provided services to the industry. Provide leading solutions.
 

With the rise of emerging markets such as 5G, artificial intelligence (AI), high-performance computing, the Internet of Things, and new energy vehicles, the topic of advanced packaging processes has spread. Creating Nano technology has made great achievements in 2.5D/3D wafer-level packaging (WLP IC). , Panel-level fan-out packaging (FOPLP) technology also shows strong application potential. The plasma desmear equipment they developed can carry out high-speed and uniform low-temperature processes for various 5G materials such as LCP, PFA, PTFE, ABF, etc. They also launched plasma polarization equipment for under-screen fingerprint recognition to further meet the needs of the market. need. Creating Nano technology's desmearing and etching equipment are not only popular in the industry, but also significantly promote the company's revenue growth.
 

Creating Nano technology's technical advantages are not limited to packaging, ABF carrier board and other fields, but also cover high aspect ratio, low-temperature processes. Its fully automated batch and continuous plasma equipment is used in Desmear and Glue residue removal. (Descum), surface cleaning and modification, etc., we provide a number of plasma technology solutions, which have characteristics such as high etching rate and uniformity. They are not only widely favored by customers, but also continue to obtain various terminal certifications. In addition, plasma etching machines used in anisotropic etching also provide strong support for precision packaging technology. Creating's continuous atmospheric plasma treatment equipment has become a key technology for improving film adhesion.
 

While responding to the demand for hybrid bonding technology, Creating Nano technology has also launched a new product for the flexible printed circuit board (FPC) market in response to challenges such as thinning of advanced packaging, high-precision circuits, and high aspect ratio of laser drilling holes. Roll-to-roll plasma desmear equipment. The equipment can process sheets with the thinnest thickness of 13μm to 200μm, and achieves high-speed and efficient slag removal at a production speed of 5 meters per minute. In addition, this technology’s low-temperature process control, with temperatures below 80 degrees, makes it an ideal solution for high-throughput and high-performance computing packaging technology.
 

In terms of green energy and sustainable development, Creating Nano technology uses its plasma technology to launch microwave torch plasma technology. This technology does not require electrodes, can handle various types of reactants, and harmlessly treat harmful gases such as PFC, N2O, and VOCs. In addition, it can also be used in the conversion and decarbonization process of hydrocarbons to produce carbon-free or low-carbon fuels, making an important contribution to the green energy industry.
 

As packaging technology continues to evolve, Creating Nano technology will continue to lead industrial change with its leading plasma technology and equipment research and development capabilities and become an important promoter in the field of advanced packaging and carrier board technology.
 
 

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The content of this article only represents the author’s personal views and has nothing to do with Creating.
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Creating Nano Technologies, Inc.
59 Alley 21 Lane 279, Chung Cheng Road, Yung Kang City, Tainan, TAIWAN
TEL:886-6-2323927 FAX:886-6-2013306 URL: http://www.creating-nanotech.com

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