Plasma Cleaner PC03/PC04

Creating Nano PC03/PC04 low pressure plasma cleaner system can modify all kinds of printing or adhesive substrates prior to surface activation, modification, grafting, roughening or cleaning.

• Extremely high plasma uniformity
• No substrate damage due to the use of low energy ions
• No contamination of substrates due to high energy bombardments of electrodes
• Special plasma electrode design
• High density plasma source
• High plasma performance
• Well-controlled low ion energy
• Combination of chemical reactivity and physical bombardments
• High cleaning efficiency
• Wide operation condition
• Multiple processing gases capable of achieving the best surface cleaning and treatment effects
• Fully automatic and user-friendly
• High reliability and easy maintenance
• Customization

• LCM, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED packaging, SMT, PCB, FPC, optoelectronic components, electronic components, Packaging before the clean.
• Before printing or adhesive surface roughening or cleaning.