Seizing advanced packaging business opportunities, PCB equipment manufacturers have achieved fruitful results

2024/07/12

TPCA Taiwan Circuit Board Association
July 3, 2024
Author MoneyDJ News reporter Wang Yiru

With the rise of new AI applications, demand for advanced packaging has exploded, including leading wafer foundries, IDMs, and professional packaging and testing foundries (OSAT), which are still placing additional orders for equipment manufacturers. Aiming at this opportunity, many PCB equipment manufacturers are also actively turning to the semiconductor field and are reaping fruitful results. It is expected that the operations of relevant manufacturers in the second half of this year (2024) are expected to be better than the first half of the year, and the growth momentum is expected to follow the footsteps of customers all the way to 2025.

TSMC (2330) is fully committed to its CoWoS production capacity, aiming to double its growth in 2024 and will continue to expand in 2025. The company has restarted orders for CoWoS equipment in April 2023, and the second to fourth waves of additional orders fell in June, October, and February 2024 respectively, and it is still pursuing orders to this day. Industry estimates suggest that its monthly CoWoS production capacity may reach 40,000 pieces by the end of 2024 and reach 55,000 to 60,000 pieces next year (2025).

Seeing business opportunities, many equipment manufacturers that used to focus on PCB and carrier boards are aggressively entering the advanced packaging field to expand diversified sources of performance growth. Among them, Qunyi (6664) mainly launched the RGV (Rail Guided Vehicle) automatic baking system for the ABF process. It has been successively recognized by European and American IDMs, wafer foundry manufacturers, and packaging and testing manufacturers, and has entered the field of glass substrates. In 2024 Relevant machines will continue to be shipped.

Zhisheng (2467) has entered the CoWoS, SoIC, and FOPLP supply chains and was selected as an excellent supplier by major wafer manufacturers in 2023. It mainly provides equipment such as temporary bonding machines, wafer-level vacuum laminators, and IC packaging ovens. The legal person estimates that semiconductor-related equipment accounted for about 17% of the company's revenue last year, and it is expected to increase to 30% this year. The full-year revenue can challenge the year-on-year growth of more than 20%, and with the increase in the contribution of high-end products, profits are expected to be quite bright. Eye performance.

Keqiao (4542) has formed an alliance with Jiadeng (3680) to transform its core technology into semiconductors and then lay out precision carrier boards for high-end packaging. The company cooperated with Jiadeng to develop a Panel FOUP cleaning machine (wafer carrier cleaning machine). It only took 6 to 8 months to complete the production line. It has now entered into important customers in Taiwan, the United States, South Korea and other places.

AOI inspection equipment manufacturer Yuda (3455) is still growing steadily in high-end semiconductor orders. It is said that the company has also entered the advanced packaging supply chain of major wafer manufacturers. The legal person expects that the company's semiconductor-related performance contribution this year is expected to be further amplified, among which advanced packaging revenue will double this year. The legal person expects that with the injection of high-end products, operations are expected to strengthen quarter by quarter starting from the second quarter, full-year revenue can strive to grow, and profits will challenge performance in 2021.

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