Apple joins the ranks of SoIC, UNIMICRON take advantage of it, and simultaneously wins big orders
United News Network
July 4, 2024
Author Economic Daily reporter Yin Huizhong, Zhang Chengwen/Taipei report
July 4, 2024
Author Economic Daily reporter Yin Huizhong, Zhang Chengwen/Taipei report
It is reported that the SoIC of TSMC (2330)'s advanced packaging platform has added a heavyweight customer, Apple, and is expected to be introduced into Apple's new generation M series chips. UNIMICRON, a carrier board partner, will simultaneously win large orders as the power of TSMC's related packaging platform increases. In particular, Unicom is already the main supplier of Apple's current M-series carrier boards. With the advancement of TSMC's advanced packaging, it is estimated that the demand for Unicom's carrier boards will increase significantly by two to three times this year, making it the biggest beneficiary.
As early as the 2022 Open Innovation Platform (OIP) Ecosystem Forum, TSMC announced the establishment of the new TSMC 3DFabric Alliance to accelerate system innovation. Its partners span semiconductor benchmark factories in Taiwan, Japan, the United States, and South Korea, and some of the carrier boards are in Taiwan. On behalf of UNIMICRON, the ecosystem will continue to update the system and integrate new technological developments in the future.
This time the industry has reported that Apple's M series chips are expected to be introduced into SoIC advanced packaging. This part belongs to the 3D front-end process. The industry is optimistic about it. It mainly corresponds to the supporting back-end process services, which is expected to drive more demand for carrier boards.
According to industry analysis, the 3D advanced packaging currently promoted by various manufacturers actually still requires a carrier board for the 2.5D packaging process in the backend and has a low yield rate. If there is an outlet to the sea and major manufacturers actively introduce diversified applications, future demand growth is expected.
The industry said that judging from the current largest demand for ABF carrier boards in high-speed computing, not all of them have been purchased and only use 3D packaging. Instead, 3D packaging is used for the memory part of the chip, and the subsequent processes are carried by 2.5D stacked carrier boards.
Morgan Stanley Semiconductor Industry Analyst Zhan Jiahong bluntly stated that UNIMICRON is likely to be Apple's main supplier of M2 Ultra chip substrates, and demand this year will surge two to three times compared with 2023. Judging from the research firm IDC's estimate of M2 Ultra sales last year at about 75,000 units, Morgan Stanley estimates that the number of Apple AI servers used this year will be about 200,000.
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