Taiwan's IC output value will exceed 5 trillion yuan in 2024, and it will continue to lead the market with advanced processes

2024/11/05

TechNews Financial News
October 23, 2024
Author Atkinson

Industry analysts from the Industrial Research Institute's "Looking into 2025 Industrial Development Trends Seminar" said that Taiwan's IC industry output value will officially exceed the 5 trillion yuan mark in 2024, with an annual growth of 22%, higher than the global market average.

IEK pointed out that with the vigorous development of the global semiconductor market in 2024, technological innovation and market competition within the industry will become increasingly fierce. According to WSTS forecasts, global semiconductor output is expected to exceed US$600 billion, with an annual growth of 16%, reflecting the strong performance of the market. Demand in the computing terminal market continues to grow, especially the application of high-end computing chips in the fields of smartphones, AI computing, automotive electronics and servers, which continues to promote the rapid growth of the industry.

In addition, as semiconductor technology continues to advance, advanced manufacturing processes and advanced packaging technologies are becoming the core force driving innovation throughout the industry, thereby promoting the development of more industries. In the field of semiconductor manufacturing, competition for advanced processes below 2 nanometers is intensifying, and thin film deposition technologies such as atomic layer deposition (ALD) also play an important role in nanowafer manufacturing. However, as transistor shrinkage technology approaches its bottleneck, the further extension of Moore's Law faces challenges. Heterogeneous integrated packaging technologies such as FOPLP, 2.5D packaging and 3D packaging have become the key to technological breakthroughs and create new opportunities for the semiconductor industry.

The future direction of the global semiconductor industry is also profoundly affected by the policies of various countries. The US Chip Act, the EU Chip Act, and industrial development plans in Taiwan and Japan are reshaping the ecosystem of the global semiconductor supply chain. As the core of global semiconductor manufacturing, Taiwan will continue to play a key role with policy support and technological innovation. It is estimated that Taiwan's IC industry output value will reach NT$5.3001 billion in 2024, with an annual growth rate of 22%. Driven by the demand for applications such as AI and high-performance computing, it is expected that the output value of Taiwan's IC industry will reach NT$6 trillion in 2025, with an estimated annual growth rate of 16.5%, continuing to push Taiwan's IC industry into a new era.

In terms of semiconductor manufacturing industry development trends and technological innovation, with the continuous innovation of global semiconductor manufacturing technology, 2024 will become an important turning point for the global and Taiwanese IC manufacturing industry. The global IC manufacturing industry is facing a number of technological changes and market competition is becoming increasingly fierce. Major manufacturers are accelerating the deployment of advanced process technologies to compete for the dominant position in the future market. Taiwan's IC manufacturing industry continues to demonstrate technological leadership in the global semiconductor landscape. It is estimated that Taiwan's IC manufacturing output value will reach a new high in 2024, reaching NT$3.3957 billion, a 27.5% increase from 2023.

IEK said that in terms of advanced processes, TSMC's A16 process has introduced super rails and will lead the market in 2026. Samsung and Intel plan to adopt the same technology in 2nm, indicating that competition in advanced processes is heating up again. The layout of the three major semiconductor manufacturers not only has a profound impact on the global wafer manufacturing market, but also provides more innovation opportunities for future high-performance terminal application products, especially in the fields of smartphones, PCs and servers, which are still the core driving the growth of the IC manufacturing industry. power.

In addition to advances in advanced wafer processes, the high-bandwidth memory market is also a new focus in 2024. The three major competitors, SK Hynix, Samsung and Micron, continue to expand their market share and technology in the HBM market. With the launch of new generation technologies such as HBM3E and HBM4, memory bandwidth and capacity will be further improved and become the core key technology for high-performance computing applications.

Looking forward to 2025, the global and Taiwanese IC manufacturing industries will continue to reach new peaks driven by the dual promotion of technological innovation and innovative applications of terminal electronic products. Whether it is the competition in advanced process technology or the growth of the HBM market, the technology layout and capital investment of major manufacturers will profoundly affect the industry trend in the next few years. With its leading edge in advanced process technology, Taiwan will continue to lead market development and bring more growth opportunities to the global semiconductor industry.

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