Semiconductor Exhibition debuts on 9/4, experts: Silicon photonics and panel packaging have risen to the next level

2024/08/30

TechNews Technology News
August 28, 2024
Author Central News Agency Zhang Jianzhong

The international semiconductor exhibition SEMICON Taiwan 2024 will be held at the Nangang Exhibition Hall on September 4. The scale of the exhibition and the lineup of participating industries are expected to set new records. Industry experts said that this year's semiconductor show has raised the profile of silicon photonics and panel-level packaging and highlighted their importance, which is a major feature.

The International Semiconductor Industry Association (SEMI) estimates that this year's Semiconductor Exhibition will have more than 1,000 manufacturers participating in 3,600 booths and more than 200 industry leaders from the global high-tech and semiconductor fields, all of which will set new records.

Yang Ruilin, ITRI's International Institute of Obstetrics and SEMI Member, said that this year's Semiconductor Exhibition has the theme of "Empowering AI Without Limits" and the technologies discussed are more diverse, not just advanced processes and net-zero sustainability issues; with the increasing importance of silicon photonics , this time it has particularly raised the level of silicon photonics and highlighted the importance of fan-out panel-level packaging.

Silicon photonics has become a hot topic in the semiconductor industry due to its characteristics of high bandwidth, low power consumption, long-distance transmission and cost savings. It is estimated that the global silicon photonics market is expected to reach US$7.86 billion in 2030.

The International Silicon Photonics Forum was held during the Semiconductor Exhibition, inviting experts from TSMC, ASE, Broadcom, imec, Marvell, Microsoft, MediaTek and Synopsys. Experts discuss the opportunities and challenges of silicon photonics.

Driven by the demand for 5G, smart IoT, automotive, high-performance computing and consumer products, fan-out panel-level packaging has great potential for growth. According to estimates by research institute Yole, the fan-out panel-level packaging market is expected to reach US$221 million in 2028, with a compound growth rate of 32.5% from 2023 to 2028.

During the Semiconductor Exhibition, a fan-out panel-level packaging innovation forum was held, inviting experts from Applied Materials, ASE, Everlight Chemical, InnoLux, Manz, NXP and UNIMICRON to discuss related issues technological development.

Yang Ruilin pointed out that in the past few years, former TSMC Chairman Liu Deyin personally gave a speech at the "Master Forum" of the Semiconductor Exhibition. TSMC's new Chairman Wei Zhejia did not give a speech this year. Instead, Executive Vice General Manager and Co-Chief Operating Officer Mi Yujie attended the speech.

However, TSMC also arranged for Deputy General Manager of Technology Research Cao Min, Deputy General Manager of Advanced Packaging Technology and Services He Jun, and Director of Advanced Packaging Business Development Division Zou Juelun to give speeches at different technology forums. Yang Ruilin said that TSMC’s behavior has changed and its willingness to be exposed to the outside world has increased, allowing the outside world to better understand TSMC’s development, which should be welcomed by the industry chain.

Yang Ruilin said that this year's semiconductor exhibition has more national pavilions. France, Malaysia and the Philippines have established new national pavilions, bringing the number of national pavilions to 13. It is expected that Taiwan's cooperation with foreign countries will be further deepened in the future.

(Author: Zhang Jianzhong; first picture is SEMICON Taiwan 2023, source: Science and Technology News)

【Disclaimer】
The content of this article only represents the author's personal views and has nothing to do with Creating.
The content, textual description and originality have not been confirmed by this site. This site does not make any guarantee or commitment for this article and all or part of its content, authenticity, completeness, and timeliness. It is for readers' reference only. Please verify the relevant content by yourself.

Creating Nano Technologies, Inc.
59 Alley 21 Lane 279, Chung Cheng Road, Yung Kang City, Tainan, TAIWAN
TEL:886-6-2323927 FAX:886-6-2013306 URL: http://www.creating-nanotech.com

BACK TO LIST