Apple’s PCB stockings are heating up, and TAIFLEX, the leader in upstream flexible board materials, is hitting the daily limit again
United News Network
August 26, 2024
Author: Economic Daily Reporter Yin Huizhong/Taipei Real Time Report
August 26, 2024
Author: Economic Daily Reporter Yin Huizhong/Taipei Real Time Report
Apple PCB has started to heat up the operations of major factories in conjunction with the new iPhone's full stocking, which will also first drive material demand. Benefiting from market demand and Apple concept stocks, upstream soft board copper foil basic materials leader TAIFLEX (8039) hit the daily limit again today and reached 68.4 yuan, up 6.2 yuan.
New AI applications are blooming, which is expected to drive the soft board market to continue to heat up next year. Legal persons are optimistic that global PCB leader Zhen Ding (4958) and major factory FLEXIUM (6269) will continue to grow in operations in 2025, and their growth performance is expected to exceed the industry average. The operations of TAIFLEX, a leading supplier of upstream flexible copper foil substrate materials related to flexible boards, and Taimide (3645), a PI material supplier, are also expected to benefit.
TAIFLEX previously held a press conference and revised its full-year outlook upwards. At that time, TAIFLEX mentioned that its operations had been revised upward from its original expected single-digit growth to double-digit growth. TAIFLEX General Manager Jiang Zonghan also said at the time that AI and high-speed computing are driving demand for high-frequency and high-speed materials, and the company plans to evaluate the second phase of the expansion of the Thailand factory in advance in the third quarter of this year.
As for whether this year's operating peak will be in the third quarter, Jiang Zonghan previously responded that it is true that this year's operating peak is still in the third quarter, approximately between July and August. From the perspective of the electronics industry, industrial demand is better than last year until December. Materials It will reach its peak one season earlier than the industry.
In the semiconductor materials section, TAIFLEX also mentioned previously that TAIFLEX Application Materials is optimistic about the growth of this field as it adopts advanced packaging and cooperates with the growth of packaging manufacturers' shipments. In addition, panel-level advanced packaging can improve production area under tight supply. Although it is still in its early stages, the company is also actively cooperating with industry development.
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