SEMICON Taiwan is about to debut, with 40 CoWoS and panel-level packaging factories each attracting attention

2024/08/20

TechNews Technology News
August 15, 2024
Author Atkinson

SEMICON Taiwan 2024 will be held at the Nangang Exhibition Center in early September. The organizer, SEMI International Semiconductor Association, said that international forums related to "advanced packaging technology" will be displayed at the event. These are regarded as the next trends in technology development, including global concerns. Semiconductor advanced packaging technologies such as chiplets, 3D IC, CoWoS and FOPLP (panel-level fan-out packaging) will all become the focus of market attention.

SEMI International Semiconductor Association pointed out that with the strong growth in demand for artificial intelligence (AI) and high-performance computing (HPC), the requirements for advanced packaging technology have also increased. As Taiwan's largest and most influential annual semiconductor event, SEMICON Taiwan 2024, which brings together the most complete lineup of semiconductor supply chains and the most advanced semiconductor industry technology content, will be held at Nangang Exhibition Hall 1 and 2 from September 4 to 6. The second hall was grandly opened. The exhibition covers 11 innovative technology themes that are diverse and trending towards the forefront of the industry, such as "AI chip", "advanced process", "heterogeneous integration", "silicon photonics" and "compound semiconductor", and are presented in major exhibition areas and international forums. reveal.

SEMI Global Marketing Chief and Taiwan President Cao Shilun said that after half a century of accumulation, Taiwan's semiconductor industry has gradually developed from IC design, wafer manufacturing and packaging and testing to integrated component manufacturing, establishing a complete one-stop supply chain. Now, as the industry enters a new era called "Wafer Manufacturing 2.0", this structure not only further expands and upgrades Taiwan Semiconductor's industrial landscape, but also gives Taiwan Semiconductor the potential to become a market rule-maker on the global stage, demonstrating a more Strong competitiveness and influence.

It is worth noting that SEMICON Taiwan 2024 will bring together more than 40 CoWoS-related manufacturers and more than 40 panel-level packaging manufacturer supply chains to provide the most complete supply chain lineup from equipment, materials, components and related process manufacturers. As semiconductor technology continues to evolve, the semiconductor industry is also facing more complex challenges, requiring the upstream and downstream of the supply chain to work together and expand strategic layout. Therefore, during SEMICON Taiwan 2024, TSMC and ASE will also jointly promote technological innovation and continue to deepen semiconductor development in the first 3D IC/CoWoS-driven AI chip innovation forum-Heterogeneous Integration International Forum series of events.

On the other hand, SEMICON Taiwan 2024 also has a number of technical forums focusing on advanced processes and semiconductor packaging related issues. In the 2024 Heterogeneous Integration International Summit Forum series of events, in addition to holding the panel-level fan-out packaging innovation forum for the first time, the four-day Heterogeneous Integration International Forum series of events will invite experts from Advanced Micro Devices (AMD), Intel (Intel) , Micron Technology (Micron), Samsung Electronics (Samsung Electronics) and SK hynix (SK hynix), Singapore Chiplet Unicorn Silicon Box, Sony Semiconductor (Sony Semiconductor), TSMC (TSMC) and other advanced industries and academia gathered together, Comprehensive dismantling of key technologies such as HBM, silicon photonics, CPO, Hybrid Bonding, and Liquid Cooling from multiple perspectives.

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