SEMI: Unifying the semiconductor back-end packaging process has the opportunity to break through supply bottlenecks
TechNewsTechnology News
July 23, 2024
Author Atkinson
July 23, 2024
Author Atkinson
Jim Hamajima, President of SEMI International Semiconductor Association Japan, said that the chip industry needs more international standards for back-end processes so that Intel and TSMC, including Intel and TSMC, can more effectively increase production capacity.
In an interview with Nihon Keizai Shimbun, Jim Hamajima said that many semiconductor companies are currently trying unique solutions for back-end processes. For example, TSMC and Intel use different standards, and they can’t even remember the names of these unique back-end processes. , and the production efficiency is not high. The back-end process it emphasizes includes chip packaging and testing. These processes are more fragmented than the front-end process standards of chip manufacturing. As such, as companies pursue more powerful chips, this could impact overall profitability.
Jim Hamajima pointed out that current chip packaging technology is particularly important for technological breakthroughs in chip production. Because traditional process scaling operations are facing technical limitations, this has stimulated massive R&D and commercial capacity investments in advanced packaging technologies. However, based on current market demand, the relevant production capacity needs to be more. For example, TSMC's CoWoS packaging technology is considered key to the production of cutting-edge AI chips, but the company recently warned that it is working to increase production capacity to further meet market demand in the face of current supply shortages. Therefore, once packaging technology standards can be unified in the future, there will be opportunities for more companies to join in, thereby providing more product production capacity.
Jim Hamajima also said that Japanese semiconductors are facing a talent shortage problem. Although TSMC and Japanese government-backed semiconductor startup Rapidus have continued to invest in talent cultivation, this problem shows no signs of improvement. The reason is that after the 2000s, as Japan's domestic semiconductor industry began to struggle, many experienced engineers left the industry or sought overseas development. Therefore, in order to solve the problem of talent shortage on the Japanese peninsula, he suggested that Japan should relax its visa policy for Indian engineers and students.
SEMI will hold Semicon for the first time in New Delhi, India, in September. Jim Hamajima stressed that the event will be a great opportunity to showcase Japan’s potential to local young talents. He further added that SEMI may consider matching Japanese small businesses with Indian schools in the future, as small businesses on the daily list currently face greater challenges in finding talents overseas.
Related links: https://technews.tw/2024/07/23/semiconductor-back-end-packaging-process-technology-should-be-unified/
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