• Plasma jet (torch)
Atmospheric Pressure Plasma SAP003
Production Description
Creating Nano SAP003 Atmospheric Pressure Plasma (AP Plasma) was designed by professional engineers in an eco-friendly environment to completely remove any kind of organic pollutants. SAP003 AP plasma treatment system’s unique design features and certified R&D patterns will tremendously increase surface bonding under normal operating conditions to produce ecofriendly products without compromising the reusability of materials. Our mission and value proposition is to create an error-free production environment to increase the overall benefits & profits of our clients.
Product Features
.Compact size and easy to install
.Start / Stop at any time
.Safe operation and maintenance
.Highly efficient speed
.Improved throughput of cleaning process
.Designed to support both in-line and off-line operations
.Cutting edge nozzle technology to support a range from 3~30mm
.Multiple design patterns are available
.Zero degrees of contamination & arc formation
.Designed to operate without a vacuum chamber
.Generation of Process gases: N2, Air (CDA), Oxygen

Unique Functionalities

SAP003 Atmospheric Plasma Jet effectively enhances the stability and smoothness of the surface cleaning; stabilizes the plasma flow and is arc free; has a higher degree of surface modifications; improves the life time of electrodes; improves the quality of the components package; improves the reliability of printability; has quick Interaction of adhesion and mount ability; is designed to operate and adjust the speed of the process; controls the flow of gas & target distance at any period of the process; Organic Materials include: Glass, Plastic, Metallic, Ceramics, Rubber etc.
Related solutions

.Supports all kind of Industrial surface modification and activation process

.Supports and improves various surface cleaning methods before process

.STN-LCD, TFT-LCD, OLED, PDP and OLB process of COG ITO electrode surface clean before process

.COF (ILB) and COB electrode surface cleaning process

.LCD or OLED glass cleaning process

.IC Packaging (Flip Chip, CSP, BGA, TCP, or Lead Frame, etc.) and LED package for surface cleaning and modification

.PCB surface cleaning, activation, modification

.Support Desmear process methods

.Wafer surface cleaning, coater cleaning & etching process

.Supports various Industrial electronic components surface cleaning, activation & modification

.Improved printability, adhesive surface roughening & cleaning before process

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